MPSoC Module TE0807 with Zynq UltraScale+ ZU7EV-1E and mounted Heat Spreader

Key Features
Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E
ZU7EV 900 Pin Packages
3 mm mounting holes for skyline heat spreader
Size: 52 x 76 mm
B2B Connectors: 4 x 160 pin
Rugged for shock and high vibration
128 MByte SPI Boot Flash (dual parallel)
User I/Os
    ▷ 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    ▷ Serial transceivers: 4 x GTR + 16 x GTH
    ▷ Transceiver clocks inputs and outputs
    ▷ PLL clock generator inputs and outputs
Graphic Processing Unit (GPU) + Video codec unit (VCU)
Si5345 - 10 output PLL
All power supplies on board, single 3.3V Power required
    ▷ 14 on-board DC/DC regulators and 13 LDOs
    ▷ LP, FP, PL separately controlled power domains
Support for all boot modes (except NAND)
Support for any combination of PS connected peripherals
Evenly spread supply pins for good signal integrity
Other assembly options for cost or performance optimization plus high volume prices available on request.
Development Support
There is a base board available for this module.
Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery
1 x TE0807-03-7DE21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU7EV
1 x mounted heat spreader for TE0807 (article no. KK0807-02A)
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