MPSoC Module TE0807 with Zynq UltraScale+ ZU7EV-1E and mounted Heat Spreader

Key Features: Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E; ZU7EV 900 Pin Packages; 3 mm mounting holes for skyline heat spreader; Size: 52 x 76 mm; B2B Connectors: 4 x 160 pin; Rugged for shock and high vibration; 4 GByte DDR4 SDRAM; 128 MByte SPI Boot Flash (dual parallel); User I/Os; ▷ 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks); ▷ Serial transceivers: 4 x GTR + 16 x GTH; ▷ Transceiver clocks inputs and outputs; ▷ PLL clock generator inputs and outputs; Graphic Processing Unit (GPU) + Video codec unit (VCU); Si5345 - 10 output PLL; All power supplies on board, single 3.3V Power required; ▷ 14 on-board DC/DC regulators and 13 LDOs; ▷ LP, FP, PL separately controlled power domains; Support for all boot modes (except NAND); Support for any combination of PS connected peripherals; Evenly spread supply pins for good signal integrity; Other assembly options for cost or performance optimization plus high volume prices available on request.
Development Support: There is a base board available for this module.; Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery: 1 x TE0807-03-7DE21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU7EV; 1 x mounted heat spreader for TE0807 (article no. KK0807-02A)

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